新型超薄环路热管的实验研究

doi:10.3969/j.issn.1008-0198.2025.04.016

湖南电力 ›› 2025, Vol. 45 ›› Issue (4): 112-118.doi: 10.3969/j.issn.1008-0198.2025.04.016

新型超薄环路热管的实验研究

张寒宇, 刘志春

华中科技大学热科学与工程实验室,湖北武汉 430074

收稿日期:2025-03-31 修回日期:2025-06-20 出版日期:2025-08-25 发布日期:2025-09-05
通信作者: 张寒宇（2000）,男,湖北荆门人,硕士研究生,从事超薄环路热管技术研究工作。
基金资助:
国家自然科学基金项目（52076088）

Experimental Study of a New Ultra-Thin Loop Heat Pipe

ZHANG Hanyu, LIU Zhichun

Lab of Thermal Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

Received:2025-03-31 Revised:2025-06-20 Online:2025-08-25 Published:2025-09-05

摘要/Abstract

摘要： 目前移动电子设备日益增长的高性能与轻薄化需求,对环路热管（loop heat pipe, LHP）的散热能力及厚度提出了更高要求。面向移动电子器件热管理需求,设计并制备0.71 mm厚度的新型超薄平板式LHP。在充灌率38%、无重力倾角条件下,通过实验测试系统在不同热负荷与风冷条件下的热性能。结果表明系统最大传热量达16 W,且在4~16 W热输入范围内均能稳定启动并呈现良好热响应特性。环路热阻随热输入增大而升高,最低值为1.36 ℃/W。研究表明,所设计的超薄LHP可满足峰值功耗16 W的芯片散热需求,在移动电子器件热管理领域具有显著应用潜力。

关键词: 移动电子器件冷却, 超薄环路热管, 传热性能, 漏热

Abstract: The increasing demand for high performance and thinness of mobile electronic devices has put forward higher requirements on the heat dissipation capability and thickness of loop heat pipes (LHPs). In order to meet the thermal management requirements of mobile electronic devices, a new type of ultra-thin flat-plate LHP with a thickness of 0.71 mm is designed and prepared, and the thermal performance of the system is experimentally tested under different thermal loads and air-cooling conditions with a filling rate of 38% and no gravitational inclination. The results show that the maximum heat transfer of the system reaches 16 W, and the system can be stably activated and shows good thermal response characteristics in the range of 4~16 W thermal input. The thermal resistance of the loop increases with the increase of thermal input, and the lowest value is 1.36 ℃/W. The study shows that the designed ultra-thin LHP can meet the heat dissipation demand of the chip with a peak power consumption of 16 W, and it has a significant potential for the application in the field of thermal management of mobile electronic devices.

Key words: Key Words: mobile electronic device cooling, ultra-thin loop heat pipe, heat transfer performance, heat leakage

中图分类号:

TK172.4

张寒宇, 刘志春. 新型超薄环路热管的实验研究[J]. 湖南电力, 2025, 45(4): 112-118.

ZHANG Hanyu, LIU Zhichun. Experimental Study of a New Ultra-Thin Loop Heat Pipe[J]. Hunan Electric Power, 2025, 45(4): 112-118.

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新型超薄环路热管的实验研究

Experimental Study of a New Ultra-Thin Loop Heat Pipe

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