Abstract: The increasing demand for high performance and thinness of mobile electronic devices has put forward higher requirements on the heat dissipation capability and thickness of loop heat pipes (LHPs). In order to meet the thermal management requirements of mobile electronic devices, a new type of ultra-thin flat-plate LHP with a thickness of 0.71 mm is designed and prepared, and the thermal performance of the system is experimentally tested under different thermal loads and air-cooling conditions with a filling rate of 38% and no gravitational inclination. The results show that the maximum heat transfer of the system reaches 16 W, and the system can be stably activated and shows good thermal response characteristics in the range of 4~16 W thermal input. The thermal resistance of the loop increases with the increase of thermal input, and the lowest value is 1.36 ℃/W. The study shows that the designed ultra-thin LHP can meet the heat dissipation demand of the chip with a peak power consumption of 16 W, and it has a significant potential for the application in the field of thermal management of mobile electronic devices.

Key words: Key Words: mobile electronic device cooling, ultra-thin loop heat pipe, heat transfer performance, heat leakage